Silicon wafer bonding is a procedure
that permanently or temporarily joins two substrates or wafers. This method helps
in preventing slipping, breakage, warping and die fly-off during wafer polishing,
dicing, grinding, lapping operations and head mounting.
Wafer bonding is basically used:
- To manufacture SOI (Silicon on Insulator) wafers.
- To generate intricate 3D cavities and structures, this crafts device functionality.
- In packaging methods to make close environments (vacuum packages for optical, resonators and IR procedures).
- In integration technology for combining two chips fabricated discretely (MEMS+CMOS).
Silicon
Wafer Bonding System:
Easy to handle wafer
grip thin film adhesive is positioned between the wafer and mounting base or
substrate. It can be secured by using either the high quality bonder or a hot
plate for enhanced processing repeatability and cycle time. By means of a
uniform thickness, wafer bonding agent
bonds the 4” silicon wafers for preserving
the highest adhesion for after bonding procedure. A heated solution minimally
dissolves the wafer glue, raising the high quality die yield without disturbing
the production routines.
Silicon
Wafer Bonder:
Use of the wafer bonder for mounting substrate
to wafer enhances repeatability and bond quality for improving the process time
during polishing, dicing or lapping.
Thin
Film wafer Adhesive:
The thin film advanced composite film resin
is engineered to bond wafers optics, thin film heads and other wafer substrates
during grinding, dicing, polishing and lapping.
